Detailed properties
Manufacturer | SAMSUNG | Date Code | 23+ |
Package | LQFP64 | Quantity | 88800 |
description:
SAMSUNG三星半导体 EMMC存储芯片全系列现货代理优势:
KLM8G1GETF-B041
KLM4G1FETE-B041
KLMAG1JETD-B041
KLMBG2JETD-B041
KLMBG2JETD-B041
KLM8G1GEUF-B04P
KLMDG4UCTB-B041
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
SN74LVC1G08DCKR | TI | 23+ | 2880 | BGA | Contact |
JX-K08 | SOI | 23+ | 2320 | CSP | Contact |
BAT54J,115 | NEXPERIA | 2023+ | 9898 | Contact | |
GC5035-C31Y0 | GALAXYCORE | 23+ | 9999 | CSP | Contact |
RT8259GE/GJ6(Z00) | RICHTEK | 23+ | 250000 | QFN | Contact |
TSUMV56RUU-Z1 | MSTAR | 23+ | 900 | TQFP128 | Contact |