Detailed properties
Manufacturer | SAMSUNG | Date Code | 22+ |
Package | BGA | Quantity | 888000 |
description:
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PIC16F1937-I/PT | MICROCHIP | 23+ | 30000 | QFN36 | Contact |
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TD25C512-R | TD | 23+ | 23250 | BGA | Contact |
SIM808 | SIMCOM | 23+ | 30000 | SMD | Contact |
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