Detailed properties
| Manufacturer | IR | Date Code | 2021 |
| Package | Quantity | 8852 |
description：
Recommend
More>
| MPN | Manufacturer | Date Code | Quantity | Package | Contact |
|---|---|---|---|---|---|
| W25Q16JWXHIQ | WinBond | 23+ | 8800 | BGA | Contact |
| TLC7528CDWR | TI | 23+ | 30000 | UFQFN-10 | Contact |
| GC20A3T | GalaxyCore | 23+ | 9000 | CSP | Contact |
| PI6LC48P25104LIE | DIODES | 23+ | 25000 | TSSOP-16EP | Contact |
| TK100E10N1,S1X(S | TOSHIBA | 23+ | 8850 | BGA | Contact |
| FH8552 | FULLHAN | 23+ | 8800 | BGA | Contact |